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LPKF Contac S4

Reliable through-hole plating in the development lab


Reliable through-hole plating is key to the success of the challenging PCB prototyping process. The LPKF Contac S4 unites various galvanic and chemical processes in one compact safety housing.

The board is passed through six baths of a bath cascade. This yields reliable copper layers on the surfaces of all existing vias, even in multilayer boards. 

The Contac S4 can process up to eight layers with a maximum aspect ratio of 1:10 (hole diameter to PCB thickness). It offers a subsequent tin bath step for surface protection and improved solderability

Optimized anode plate and pulse reverse plating ensure homogeneous deposition, and carbon activation using black hole technology, integrated air blow-in, and an additional process step for via cleaning ensure reliable connections to the copper surface without the problem of layer detachment. The result is a homogeneous layer thickness in the holes and on the flat metal surface of the substrate

Easy to Use

The integrated touch panel with wizard safely guides even inexperienced users through the galvanization process. The process requires no knowledge of chemistry as the system automatically indicates the necessary maintenance steps.

Datos Técnicos

LPKF Contac S4

Max. material size (X x Y)

Max. layout area (X x Y)

Reversing pulse plating


Minimum hole diameter


Chemical tinning

Process time

Electrical consumption

Dimensions (W x H x D)



200 mm x 300 mm (7.8” x 11.8”)

230 mm x 330 mm (9” x 13”)

± 2 µm (plated copper)

≥ 0,2 mm



Approx. 90 - 120 min

115 / 230 V, 50 - 60 Hz, 0,6 kW

856 mm x 446 mm x 542 mm (33.7” x 17.5” x 21.3”)

~ 80 kg unfilled, ~ 115 kg filled

Brochure LPKF
Contac S4
Download PDF

Cirentec S.A. de C.V

Hidalgo No 6,
Colonia Santa Maria Tonantzintla
San Andres Cholula, Puebla, 72840



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