Structuring 3D Circuits
Modern electronics products are showing a trend towards smaller size, greater complexity, and more functions. Extension of the interconnect pattern into the third dimension adds new potential – and laser direct structuring (LDS) is the leading technology in this field. With the ProtoLaser 3D, LPKF offers an economical and efficient laser system that accelerates prototyping of three dimensional substrates. It was developed especially for LDS prototyping but is based on the proven ProtoLasers used for PCB prototyping.
Flexible Laser Machining
The work platform with dimensions of 500 mm x 500 mm has a z-axis travel of 200 mm. A pilot laser and a powerful vision system aid in structuring. The laser optical components in the ProtoLaser 3D correspond to those used in the LDS production systems. The LDS design rules also apply to the prototyping process.
The ProtoLaser 3D imports data from conventional layout programs and is supplied with the powerful LPKF CircuitPro 3D CAM software. A simple, low-cost workpiece fixture can be used for structuring because no mechanical stresses are created in the process. The vision system detects fiducials and part contours and significantly simplifies structuring in different positions.