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LPKF ProtoLaser U4

Micromaterial Processing with Laser Technology


Universal Usability

The LPKF ProtoLaser U4 uses a UV laser source. Many material groups are easy to process at these wavelengths – without additional tools, masks, or films. The LPKF ProtoLaser U4 builds on the success of its predecessor and expands its range of applications with targeted innovations.

New Design
The LPKF ProtoLaser U4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. The control PC is integrated into the ProtoLaser U4.


Stabilization of the Low-Energy Range

Delicate, sensitive processes do not require a lot of laser energy, but rather especially little. Multiple processing produces highly precise structures on sensitive substrates. The new UV laser source is now stabilized across a large performance range. It can now safely process additional material groups and thin layers.

Process Tracking

A new performance measuring field determines the actual laser performance in the focal position and displays it. Here, LPKF has met demands from customers who want exact actual data for documentation.

Vision System

The LPKF ProtoLaser U4 uses a newly designed vision system optimized for laser micro material processing. The camera and image recognition process probe any fiducials or geometric structures on the substrate to be processed. A higher resolution and faster detection algorithms accelerate the manufacturing process.

  • Broad processing range due to UV laser

  • Stabilized in the lower performance range

  • Output measurement at substrate level

The laser process itself stands out from competing processes due to its high flexibility and fast processing. The laser uses no environmentally hazardous chemicals, requires no masks and keeps outlay for tool production to a minimum. The laser works contact-free and therefore can also be used with sensitive materials.

The ProtoLaser U4 can make prototypes of a quality that meets or even exceeds that of industrial processing. It is also suitable for small series production and for production of individual components with high variance.

Datos Técnicos

LPKF ProtoLaser U4

Max. material size and layout area (X x Y x Z)

Laser wavelength

Structuring speed

Cutting speed

Minimum line / space

Laser pulse frequency

229 mm x 305 mm x 10 mm
(9” x 12” x 0.4”)

355 nm

200 mm/s (7.8”/s) on 18 μm (½ oz)

200 mm/s (7.8”/s) 0.5 mm (0.02”) FR4*

25 kHz – 300 kHz

50 μm / 20 μm (2 mil / 0.8 mil), 
on laminated subtrate (18 µm Cu)

Laser spot diameter in focus position

20 μm


Dimensions (W x H x D)


Electrical consumption

Required compressed air supply

Required accessories

± 1.98 μm (± 0.08 mil)

910 mm x 1 650 mm x 795 mm (35.8” x 65” x 31.3”);
height with open door 1 765 mm (69.5”)

350 kg

Min. 8 bar (116 psi), min. 450 l/min (15.89 cfm)

110 V - 230 V; 1.4 kW

Exhaust unit, compressor, PC

Brochure LPKF ProtoLaser U4
Download PDF

Cirentec S.A. de C.V

Hidalgo No 6,
Colonia Santa Maria Tonantzintla
San Andres Cholula, Puebla, 72840



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